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  Datasheet File OCR Text:
 Power Transistors
2SB0928 (2SB928), 2SB0928A (2SB928A)
Silicon PNP epitaxial planar type
For Power amplification For TV vertical deflection output Complementary to 2SD1250 and 2SD1250A Features
* High collector-emitter voltage (Base open) VCEO * High collector power dissipation PC * N type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment.
Unit : mm
8.50.2 6.00.2 3.40.3 1.00.1
10.00.3 1.50.1
4.40.5
Absolute Maximum Ratings TC = 25C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage 2SB0928 (Base open) 2SB0928A VEBO IC ICP PC Ta = 25C Tj Tstg Symbol VCBO VCEO Rating -200 -150 -180 -6 -2 -3 30 1.3 150 -55 +150 C C V A A W Unit V V
(6.5)
1 : Base 2 : Collector 3 : Emitter N-G1 Package
Emitter-base voltage (Collector open) Collector current Peak collector current Collector power dissipation Junction temperature Storage temperature
Note) Self-supported type package is also prepared
Electrical Characteristics TC = 25C 3C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) 2SB0928 2SB0928A VEBO ICBO IEBO hFE1 * hFE2 Base-emitter voltage Collector-emitter saturation voltage Transition frequency VBE VCE(sat) fT IE = -500 A, IC = 0 VCB = -200 V, IE = 0 VEB = -4 V, IC = 0 VCE = -10 V, IC = -150 mA VCE = -10 V, IC = -400 mA VCE = -10 V, IC = -400 mA IC = -500 mA, IB = -50 mA VCE = -10 V, IC = - 0.5 A, f = 10 MHz 40 60 50 -1.0 -1.0 V V MHz Symbol VCBO VCEO Conditions IC = -500 A, IE = 0 IC = -5 mA, IB = 0 Min -200 -150 -180 -6 -50 -50 240 V A A Typ Max Unit V V
Emitter-base voltage (Collector open) Collector-base cutoff current (Emitter open) Emitter-base cutoff current (Collector open) Forward current transfer ratio
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Rank hFE1 Q 60 to 140 P 100 to 240 Note) The part numbers in the parenthesis show conventional part number.
Publication date: February 2003 SJD00010BED
(7.6)
(1.5)
1
2
0.80.1 R = 0.5 R = 0.5 2.540.3 1.00.1 1.40.1 0.40.1 5.080.5 (8.5) (6.0) 1.3 3
2.00.5
4.40.5
0 to 0.4
14.40.5
3.0+0.4 -0.2
1.5+0 -0.4
1
2SB0928, 2SB0928A
PC Ta
40 (1)TC = Ta (2)With a 50 mm x 50 mm x 2 mm Al heat sink (3)Without heat sink (PC = 1.3 W)
-600
IC VCE
-2.0
TC = 25C IB = -4.5 mA -4.0 mA -3.5 mA -3.0 mA -2.5 mA -2.0 mA -1.5 mA -1.0 mA - 0.5 mA
IC VBE
VCE = -10 V -1.6
Collector power dissipation PC (W)
Collector current IC (A)
Collector current IC (A)
30
(1)
-500
25C -1.2 TC = 100C
-400
20
-300
- 0.8
-200
-25C
10 (2) (3) 0 0 40 80 120 160
-100
- 0.4
0
0
-2
-4
-6
-8
-10
-12
0
0
- 0.2
- 0.4
- 0.6
- 0.8
-1.0
Ambient temperature Ta (C)
Collector-emitter voltage VCE (V)
Base-emitter voltage VBE (V)
VCE(sat) IC
Collector-emitter saturation voltage VCE(sat) (V)
-10 IC / IB = 10
104
hFE IC
VCE = -10 V
fT I C
104 VCE = -10 V f = 10 MHz TC = 25C
Forward current transfer ratio hFE
Transition frequency fT (MHz)
103 TC = 100C 25C 102 -25C
103
-1 TC = 100C 25C -25C
102
- 0.1
10
10
- 0.01 - 0.01
- 0.1
-1
1 - 0.01
- 0.1
-1
-10
1 - 0.01
- 0.1
-1
-10
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
Safe operation area
-10 ICP t = 0.5 ms IC -1 t = 5 ms Non repetitive pulse TC = 25C
Rth t
103 (1)Without heat sink (2)With a 50 mm x 50 mm x 2 mm Al heat sink (1) (2) 10
t = 1 ms
t = 300 ms
Thermal resistance Rth (C/W)
102
Collector current IC (A)
1
- 0.1
2SB0928
2SB0928A
10-1
- 0.01 -1
-10
-100
-1 000
10-2 10-4
10-3
10-2
10-1
1
10
102
103
104
Collector-emitter voltage VCE (V)
Time t (s)
2
SJD00010BED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL


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